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SERIAL EEPROM 24C02A

transistor BC558

SEVAN SEGMENT

transistor BC 548

transistor 2N2222

IC 74LS47

ULN2003

UM66 IC

IC L293D

IC 7906

Injection die Molding

Injection die Molding

Injection die Molding In this process, thermoplastic materials soften when heated and re-harden when cooled. No chemical change takes place during heating and cooling. Fig. illustrates...
COPPER

Copper Material

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